When a BGA (Ball Grid Array) joint fails it is usually due to the type of solder used in the mass production. Health & safety specifies that they manufacturers can only use specific types of solder which have a relitivitely short lifespan of 3-5 years. After this time period, they start to separate from the board and can cause fluctuations within the data/power stream passed through them.
This was one of the main reasons for the now famous “red ring of death” with certain games consoles.
Utilising a combination of ultra precise infra red laser technology, precise hot air and specialist tools we can pinpoint errors and repair these faults. We use better condition solder with higher melting points which enable a smoother flow into the repaired area, thus giving a repair that is more stable than the original factory condition.